MO-271A
| Внешний вид | .SLDPRT model, info | Description |
|
 MO-271A MO-271A
|
Small outline packages, (7.60 x 10.30) mm body with an exposed pad. 2.45 mm Max Height. (F)-PDSO / SOIC, SOP |
MO-271A Variations, STEP models
| JEDEC Name | IPC-7351 Footprint | Description |
 MO-271.AA | SOP100P1040X245_HS1-20 | 20-leads, 1 mm Pitch, (7.5 x 5) mm Thermal Pad |
| MO-271.AB | SOP100P1040X245_HS2-20 | 20-leads, 1 mm Pitch, (5.5 x 5) mm Thermal Pad |
| MO-271.BA | SOP80P1040X245_HS1-24 | 24-leads, 0.8 mm Pitch, (7.5 x 5) mm Thermal Pad |
| MO-271.BB | SOP80P1040X245_HS2-24 | 24-leads, 0.8 mm Pitch, (5.5 x 5) mm Thermal Pad |
| MO-271.CA | SOP65P1040X245_HS1-28 | 28-leads, 0.65 mm Pitch, (7.5 x 5) mm Thermal Pad |
| MO-271.CB | SOP65P1040X245_HS2-28 | 28-leads, 0.65 mm Pitch, (5.5 x 5) mm Thermal Pad |
| MO-271.DA | SSOP50P1040X245_HS1-36 | 36-leads, 0.5 mm Pitch, (7.5 x 5) mm Thermal Pad |
| MO-271.DB | SSOP50P1040X245_HS2-36 | 36-leads, 0.5 mm Pitch, (5.5 x 5) mm Thermal Pad |