Микросхемы
Внешний вид | Модели | Описание |
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Dual In-line Package Pitch 2.54 mm DIP8 DIP14 DIP16 DIP24 (WIDE) |
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Small-outline integrated circuit Standard 50 mil Pitch SOICs SOIC-8 (SO-8) SOIC-14 (SO-14) SOIC-16 (SO-16) |
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Small-outline integrated circuit Nonstandard 50 mil Pitch SOICs |
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Thin Small Outline Packages Pitch 0.65 mm |
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Thin Shrink Small Outline Package 10 Pin Pitch 0.5 mm |
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Thin Shrink Small Outline Package Pitch 0.4, 0.5 mm |
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Thin Quad Flat Package Height < 1.6 mm Pitch 0.65, 0.8, 1.0 mm |
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Thin Shrink Quad Flat Package Height < 1.6 mm Pitch 0.4, 0.5 mm |
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Thin Shrink Quad Flat Package Height < 1.6 mm Pitch 0.4, 0.5 mm Pin >100 |
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Plastic Leaded Chip Carrier PLCC-68 |
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Ultra compact and reliable wireless module |
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Quad Flat No leads Packages QFN-44 Pitch 0.5 mm QFN-68 Pitch 0.4 mm |
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Quad Flat No leads QFN-12 (10+2 Pin) |
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SOT Generic Package 0.5 mm Pitch |