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Библиотека

Микросхемы

Внешний вид	Модели	Описание
	DIP DIP8 DIP14 DIP16 DIP24	Dual In-line Package Pitch 2.54 mm DIP8 DIP14 DIP16 DIP24 (WIDE)
	SOP SOIC127P600-8 SOIC127P600-14 SOIC127P600-16	Small-outline integrated circuit Standard 50 mil Pitch SOICs SOIC-8 (SO-8) SOIC-14 (SO-14) SOIC-16 (SO-16)
	SOIC127P1030-16 SOIC127P1030-20 SOIC127P1200-24	Small-outline integrated circuit Nonstandard 50 mil Pitch SOICs
	TSOP65P490-8 TSOP65P640-14 TSOP65P640-16	Thin Small Outline Packages Pitch 0.65 mm
	TSSOP50P490-10	Thin Shrink Small Outline Package 10 Pin Pitch 0.5 mm
	TSSOP50P1600-24 TSSOP50P1600-32 TSSOP40P1800-40	Thin Shrink Small Outline Package Pitch 0.4, 0.5 mm
	QFP TQFP80P900X900-32 TQFP80P1600X1600-64 TQFP65P1200X1200-52 TQFP100P1600X1600-44	Thin Quad Flat Package Height < 1.6 mm Pitch 0.65, 0.8, 1.0 mm
	TSQFP50P700X700-32 TSQFP50P900X900-48 TSQFP40P900X900-64 TSQFP40P1200X1200-80	Thin Shrink Quad Flat Package Height < 1.6 mm Pitch 0.4, 0.5 mm
	TSQFP40P1600X1600-120 TSQFP40P1600X1600-128 TSQFP50P1600X1600-100 TSQFP50P2200X2200-144	Thin Shrink Quad Flat Package Height < 1.6 mm Pitch 0.4, 0.5 mm Pin >100
	PLCC-68 PLCC-68	Plastic Leaded Chip Carrier PLCC-68
	SIM900 SIM900	Ultra compact and reliable wireless module
	QFN QFN50P700X700-44 QFN40P800X800-68	Quad Flat No leads Packages QFN-44 Pitch 0.5 mm QFN-68 Pitch 0.4 mm
	QFN50P300X300-10-2 QFN50P300X300-10-2	Quad Flat No leads QFN-12 (10+2 Pin)
	SOT50P240-8 SOT50P240-8	SOT Generic Package 0.5 mm Pitch