Библиотека


MS-024H

Внешний вид .SLDPRT model, info Description
MS-024H
MS-024H
Standard - Thin Small Outline Package. TSOPII Package, Max Height 1.2 mm. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

MS-024H Variations, STEP models

JEDEC Name IPC-7351 Footprint Description
MS-024.AA TSOP127P1176X120-28 28-leads, 1.27 mm Pitch, 18.61 mm Max Package Length
MS-024.AB TSOP127P1176X120-24 24-leads, 1.27 mm Pitch, 18.61 mm Max Package Length
MS-024.AC TSOP80P1176X120-40 40-leads, 0.8 mm Pitch, 18.61 mm Max Package Length
MS-024.BA TSOP127P1176X120-32 32-leads, 1.27 mm Pitch, 21.15 mm Max Package Length
MS-024.BB TSOP80P1176X120-44 44-leads, 0.8 mm Pitch, 21.15 mm Max Package Length
MS-024.BC TSOP80P1176X120-50 50-leads, 0.8 mm Pitch, 21.15 mm Max Package Length
MS-024.BD TSSOP50P1176X120-80 80-leads, 0.5 mm Pitch, 21.15 mm Max Package Length
MS-024.CA TSOP127P1176X120-36 36-leads, 1.27 mm Pitch, 23.69 mm Max Package Length
MS-024.CB TSOP65P1176X120-70 70-leads, 0.65 mm Pitch, 23.69 mm Max Package Length
MS-024.DA TSOP127P1176X120-40 40-leads, 1.27 mm Pitch, 26.23 mm Max Package Length
MS-024.EA TSOP80P1176X120-70 70-leads, 0.8 mm Pitch, 28.77 mm Max Package Length
MS-024.FA TSOP80P1176X120-54 54-leads, 0.8 mm Pitch, 22.42 mm Max Package Length
MS-024.FB TSSOP50P1176X120-86 86-leads, 0.5 mm Pitch, 22.42 mm Max Package Length
MS-024.FC TSOP65P1176X120-66 66-leads, 0.65 mm Pitch, 22.42 mm Max Package Length
MS-024.GA TSSOP40P1176X120-54 54-leads, 0.4 mm Pitch, 11.4 mm Max Package Length



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