MS-024H
Внешний вид | .SLDPRT model, info | Description |
MS-024H MS-024H |
Standard - Thin Small Outline Package. TSOPII Package, Max Height 1.2 mm. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S) |
MS-024H Variations, STEP models
JEDEC Name | IPC-7351 Footprint | Description |
MS-024.AA | TSOP127P1176X120-28 | 28-leads, 1.27 mm Pitch, 18.61 mm Max Package Length |
MS-024.AB | TSOP127P1176X120-24 | 24-leads, 1.27 mm Pitch, 18.61 mm Max Package Length |
MS-024.AC | TSOP80P1176X120-40 | 40-leads, 0.8 mm Pitch, 18.61 mm Max Package Length |
MS-024.BA | TSOP127P1176X120-32 | 32-leads, 1.27 mm Pitch, 21.15 mm Max Package Length |
MS-024.BB | TSOP80P1176X120-44 | 44-leads, 0.8 mm Pitch, 21.15 mm Max Package Length |
MS-024.BC | TSOP80P1176X120-50 | 50-leads, 0.8 mm Pitch, 21.15 mm Max Package Length |
MS-024.BD | TSSOP50P1176X120-80 | 80-leads, 0.5 mm Pitch, 21.15 mm Max Package Length |
MS-024.CA | TSOP127P1176X120-36 | 36-leads, 1.27 mm Pitch, 23.69 mm Max Package Length |
MS-024.CB | TSOP65P1176X120-70 | 70-leads, 0.65 mm Pitch, 23.69 mm Max Package Length |
MS-024.DA | TSOP127P1176X120-40 | 40-leads, 1.27 mm Pitch, 26.23 mm Max Package Length |
MS-024.EA | TSOP80P1176X120-70 | 70-leads, 0.8 mm Pitch, 28.77 mm Max Package Length |
MS-024.FA | TSOP80P1176X120-54 | 54-leads, 0.8 mm Pitch, 22.42 mm Max Package Length |
MS-024.FB | TSSOP50P1176X120-86 | 86-leads, 0.5 mm Pitch, 22.42 mm Max Package Length |
MS-024.FC | TSOP65P1176X120-66 | 66-leads, 0.65 mm Pitch, 22.42 mm Max Package Length |
MS-024.GA | TSSOP40P1176X120-54 | 54-leads, 0.4 mm Pitch, 11.4 mm Max Package Length |